Gordon,
Quote:The bond coat material that you use may be much more difficult to measure though and may cause some calibration problems later for the ceramic coating. The instrument will require calibration on bond coated substrate as the bond coat will alter properties depending on thickness. These instruments can be very sensitive and accurate if set up well, but they really do need to be cross-checked/compared to other measuring methods like micrometer/vernier or cross-section metallography.
Specific to TBC application, do you mean the daily check or calibration on the master test piece may not be giving you accurate top coat thickness even though we know after the master test piece verification, we are very sure that the probe or isoscope is working fine?
In your opinion, if the probe/isoscope shows very little error (<1%) when checked on master test films, and yet shows a great variation of 0.002" ~0.003" difference compared to metallurgraphy cut-up thickness check, this is due the the bond coat thickness which has alter the
properties? Can u elaborate further?
I am having this prob. I conducted a studies on my instrument which uses eddycurrent application to check coating thickness, to see the variation compared to a flat anvil micometer, point micrometer, and metallurgical cut-up.
It surprises me when the variation between isoscope and metallugical cut-up is as such (0.002" to 0.003")at Mean!
whereas the shape point micrometer very close to the metallurgical evaluated result. And Flat Anvil is inbetween the rpobe and the shaped point mic & metallurgy cut up. I do not do use the same bond coat surface and do the cal or zeroing. should I do so
Pls advice..
Regards,
Alexangel1226