(10-06-2015, 05:48 AM)Dileep Wrote: Hi Friends,
Is there any way to reduce the cooling time of the job in the thermal spray passes maintaining the inter pass temperature.
Right now am using pressurized air for cooling the job.
Is there any better way than this.
Thanks in advance.
Hi Dileep,
There's a few things to consider,
*Process type.
*Substrate material.
*Component size, and mass.
*Linear speed (sfpm or m/min)
*Step size (mm or inches/rotation.
*Material type (powder type used).
*Spray distance.
*Feed Rate.
*Deposition rate (thickness per pass/cycle).
*Type of cooling jets and or tubes.
Controlling the application temperature is the first thing to look at before considering additional expenses to other cooling techniques. If that doesn't give you the results, then by all means go for something more radical.
Typically, the three main factors; linear speed, step size (traverse rate) and feed rate, ultimately determine deposition rate per cycle, pass or scan due to the feed rate being a relatively fixed constant.
Even at a close spray distance if you adjust the previous three to control deposition rate, you can minimize the maximum temperature of the application combined with cooling jets and vortex tubes.
Regards,
John