Re: 410 SS HVOF Application

Posted by john winne ( on 18:30:54 21/02/05

In Reply to:410 SS HVOF Application posted by john winne

What we found is that by changing the PSD to -38um (from -53), we were able to achieve the necessary microstructure. The specification we have been attempting to achieve makes no mention of unmelt count, but we have been informed that ours was unacceptable. The specification further indicated that an increased presence of oxides was preferred. We have attempted to apply this with Plasma, HP/HVOF and HVOF. All three have produced acceptable microstructures, none have passed 10Ksi bond testing, and only the Plasma has met the <37Rc requirement @ 27Rc

Any thoughts on how to drop the hardness numbers? 36 with HVOF. 45 with HP/HVOF.

We have also been informed that the FM1000 adhesive we have been using produces 'true' results, and that others (like EP15) produce artificially higher results, as much as 2Ksi higher. It is unknown which adhesive was used to determine the 10Ksi specification. We have made a number of tests with the FM1000 and various application methods.

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